• Lower LCOE , reduced BOS cost, better ROI
• Lowest guaranteed rst year and annual degradation
• Optimized compatibility with existing mainstream system components
• Up to 22.2% module efficiency
• High density interconnection provides improved power density
• MBB technology improves lighttrapping effect and currentcollection,
while lowering series resistance
• Minimized micro-cracks with innovative non-destructive cutting
technology minimizes micro-cracking
• Ensured PID resistance through improved cell process and module
material control
• Resistant to harsh environments
• Mechanical performance up to +5400/-2400 Pa
• Excellent IAM and low irradiation performance, validated by 3rd party
certifications
• The unique design provides optimized energy production under
inter-row shading conditions
• Lower temperature coefficient (-0.30%) and operating temperature
• Up to 30% additional power gain from back side
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